Five Advantages of LTE IoT Module Compared to Traditional LTE Module

ThinkWill exclusively invented a range of LTE IoT modules upgraded from classic LTE modules and obtained valuable feedback from the IoT market on its performance. So how does this new LTE IoT module overperform the regular LTE module and become the latest market trend?

Advantage #1: More Convenience to Utilization 

Traditional LTE module adopting chip-level PCBA schematic and layout design VS Plug-and-play IoT component embracing standard industrial socket connection

The applications of traditional modules of which package/form factor LCC/LGA, require engineers to possess a thorough understanding of each pin's definition and connection methods very clearly, as well as rich experience of chip-level PCBA schematic and layout design for wireless communication modules, to make sure module functions and performances following the 3GPP2 standard and high probability of one-time success. Therefore, there is an extremely strict technical requirement for secondary designers' deep involvement in wireless communication terminals.

However, LTE IoT Module can be a different development procedure. This IoT module is a finished function module that has completed the elementary wireless communication development. It has already integrated and encapsulated necessary software and hardware internally, outfitting general standard interfaces and industrial sockets, plug-and-play, simple and easy.

Advantage #2: Shorter Development Cycle

2-3 months uncertainty of the engineering sample VS 1 week prototype publication

To go through the whole development process of classic modules, usually, it contains PCBA design, PCB proofing, trial production and patch, wireless performance debugging, hardware function debugging, driver software, and function debugging and takes at least two months to proceed, possible much longer time if encountering unpredictable troubles.

Can this cycle be shortened? SURE! Equipped with complete LTE wireless communication capability and integrated unit design on software and hardware, the LTE IoT module supports functional debugging immediately after being attached to standard connectors. In comparison, it just takes 3-7 days by fastest to establish the customized prototype as requested and have the demo accomplish a new form of business model demonstration.

Advantage #3: Basic Protocol and Built-in Functions

Secondary code development on software function VS Self-networking (even cloud platform) power-on

For instance, the LTE IoT router module includes a built-in basic Ethernet routing protocol, offering instant Internet visits after being powered and some fundamental routing management functions.

Advantage #4: More Stable and Reliable Wireless Baseband Performance

Professional experience in RF wireless link, high-speed data line, audio link, EMC protection design, layout, and wiring

Depending on ThinkWill's over ten years' experience in launching cellular wireless communication modules and terminals, this highly integrated LTE IoT Module ensures:

• performance of radio frequency matching the 3GPP standards;
• high-speed data transfer rate meeting the 3GPP standards;
• optimization of audio sound quality;
• the unified design of the EMC protection complying with the CCC/CE/FCC certificate;

Advantage #5: Lower Manufacturing Cost on Terminal

RF calibration and testing cost of LTE performance during SMT production VS Component assembly cost

The manufacturing process of PCBA on traditional chip-level wireless communication modules must set up an RF performance inspection station running 100% full inspection(long time checkup) after high-temperature SMD and reflow soldering, to higher final passed yield and ensure RF performance adhering to 3GPP standards. Meanwhile, the testing workstation needs equipping with highly professional and costly testing machines special for RF performance examination. Therefore, the more production capacity, the more testing workstations, and the more overall costs. As a result, the requirements for the processing factory capacity and the manufacturing cost are both super high.

In contrast, the LTE IoT Module has finished 100% RF index calibration and final inspections before being delivered. The secondary processing of the connector assembly does not need to bear the possible damage of high-temperature SMD. In the end, just necessarily execute the RF performance sampling inspection and 100% function inspection of the assembled terminals.